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DATA SHEET
GaAs INTEGRATED CIRCUIT
PG133G
L-BAND SPDT SWITCH
DESCRIPTION
UPG133G is an L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 8 pin SSOP that is smaller than usual 8 pin SOP and easy to install and contributes to miniaturizing the system. It can be used in wide-band switching applications.
FEATURES
* Maximum transmission power : * Low insertion loss * High switching speed * Small package : : : 0.25 W (typ.) 0.6 dB (typ.) at f = 2 GHz 10 ns 8 pins SSOP
APPLICATION
* Digital cordless telephone : PHS, PCS, DECT etc. * Digital hand-held cellular phone, WLAN
ORDERING INFORMATION
PART NUMBER PACKAGE 8 pin plastic SSOP PACKING FORM Carrier tape width 12 mm. QTY 2kp/Reel.
PG133G-E1
For evaluation sample order, please contact your local NEC sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25 C)
Control Voltage Input Power Total Power Dissipation Operating Case Temperature Storage Temperature CAUTION: VCONT Pin Ptot Topt Tstg -6 to +0.6 25 0.2 -65 to +90 -65 to +150 V dBm W C C
The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET.
Document No. P10733EJ2V0DS00 (2nd edition) Date Published April 1996 P Printed in Japan
(c)
1996
PG133G
PIN CONNECTION DIAGRAM (Top View)
1. VCONT2
1 2 3 4
8 7 6 5
2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. VCONT1
SPDT SWITCH IC SERIES PRODUCTS
PART NUMBER Pin (1dB) (dBm) +34 +30 +34 +30 +30 +25 LINS (dB) 0.5 @1G 0.6 @2G 0.5 @1G 0.6 @2G 0.6 @2G 0.6 @2G ISL (dB) 32 @1G 23 @2G 32 @1G 23 @2G 22 @2G 20 @2G VCONT (V) -5/0 -4/0 -5/0 -4/0 +3/0 -3/0
PACKAGE 8 pin SOP (225 mil) 8 pin SSOP (175 mil)
APPLICATIONS PDC, IS-136, PHS PHS, PCS, WLAN PDC, IS-136, PHS PHS, PCS, WLAN PHS, PCS, WLAN DIVERSITY etc
PG130GR PG131GR PG130G PG131G PG132G PG133G
Remark: As for detail information of series products, please refer to each data sheet. EQUIVALENT CIRCUIT
OUT1
GND IN VCONT1
VCONT2 GND
OUT2
2
PG133G
RECOMMENDED OPERATING CONDITIONS
PARAMETER Control Voltage (ON) Control Voltage (OFF) Input Power Level SYMBOL VCONT VCONT Pin MIN. -0.2 -5.0 TYP. 0 -3.0 21 MAX. +0.2 -2.7 24 UNIT V V dBm
ELECTRICAL CHARACTERISTICS (TA = 25 C)
CHARACTERISTICS Insertion Loss SYMBOL LINS MIN. TYP. 0.6 0.8Note1 Isolation ISL 20 20Note1 Input Return Loss Output Return Loss Input Power at 1dB Compression Point Switching Speed Control Current RLin RLout Pin (1dB)Note2 11 11 21 20 20 25 dB dB dBm dB f = 2.5 GHz f = 100 MHz to 2 GHz VCONT1 = 0 V VCONT2 = -3 V or tsw ICONT 10 50 ns VCONT1 = -3 V VCONT2 = 0 V MAX. 1.0 UNIT dB f = 2.5 GHz TEST CONDITION
A
Notes 1: Characteristic for reference at 2.0 to 2.5 GHz 2: Pin (1dB) is measured the input power level when the insertion loss increase more 1dB than that of linear range. All other characteristics are measured in linear range. NOTE ON CORRECT USE * Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed to same side of No. 5 pin (IN). * The distance between IC's GND pins and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters.
3
PG133G
TYPICAL CHARACTERISTICS (TA = 25 C) Note This data is including loss of the test fixture.
IN-OUT1 INSERTION LOSS vs. FREQUENCY + 2.0 VCONT1 = -3 V VCONT2 = 0 V Pin = 0 dBm IN-OUT1 ISOLATION vs. FREQUENCY 0 VCONT1 = 0 V VCONT2 = -3 V Pin = 0 dBm
LINS - Insertion Loss - dB
+ 1.0
0
ISL - Isolation - dB
500 M LINS OUT1 IN 50 OUT2 1G 2G 3G
-10
-20
- 1.0
- 30
- 2.0 - 3.0 100 M 200 M f - Frequency - Hz
- 40 - 50 100 M 200 M f - Frequency - Hz
500 M
1G ISL
2G 3G
OUT1 IN 50 OUT2
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY + 10 VCONT1 = -3 V VCONT2 = 0 V Pin = 0 dBm
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY + 10 VCONT1 = -3 V VCONT2 = 0 V Pin = 0 dBm
0
RLout - Output Return Loss - dB
RLin - Input Return Loss - dB
0
-10
-10
- 20
- 20
- 30 - 40 100 M 200 M f - Frequency - Hz
- 30 - 40 100 M 200 M f - Frequency - Hz
500 M RLin
1G
2G 3G
500 M
1G
2G 3G RLOUT OUT1
OUT1 IN 50 OUT2 IN 50
OUT2
4
PG133G
IN-OUT2 INSERTION LOSS vs. FREQUENCY + 2.0 LINS - Insertion Loss - dB VCONT1 = 0 V VCONT2 = -3 V Pin = 0 dBm ISL - Isolation - dB
IN-OUT2 ISOLATION vs. FREQUENCY 0 VCONT1 = -3 V VCONT2 = 0 V Pin = 0 dBm
+ 1.0
-10
0
-20
- 1.0
- 30
- 2.0 - 3.0 100 M 200 M f - Frequency - Hz OUT1 50 IN LINS OUT2
- 40 - 50 100 M 200 M f - Frequency - Hz OUT1 50 IN ISL OUT2
500 M
1G
2G 3G
500 M
1G
2G 3G
IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY + 10 RLin - Input Return Loss - dB VCONT1 = 0 V VCONT2 = -3 V Pin = 0 dBm
IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY + 10 RLout - Output Return Loss - dB VCONT1 = 0 V VCONT2 = -3 V Pin = 0 dBm
0
0
-10
-10
- 20
- 20
- 30 - 40 100 M 200 M f - Frequency - Hz
- 30 - 40 100 M 200 M f - Frequency - Hz
500 M RLin
1G
2G 3G
500 M
1G
2G 3G OUT1 50
OUT1 50 IN OUT2
IN
OUT2 RLOUT
5
PG133G
IN-OUT2 Pin vs. Pout VCONT1 = 0 V VCONT2 = -3 V f = 1.9 GHz
30 Pout - Output Power - dB 28 26 24 22 20 18 18
OUT1 50 IN OUT2
20 22 24 26 28 30 Pin - Input Power - dBm
INPUT POWER vs. OUTPUT POWER VCONT1 = 0 V VCONT2 = -3 V 30 f = 2GHz Non-modulated signal input (CW) 25 TA = -50 C TA = +25 C TA = +90 C
INSERTION LOSS, 2fo, 3fo vs. AMBIENT TEMPERATURE
VCONT1 = 0 V VCONT2 = -3 V f = 2 GHz Pin = +20 dBm Signal input (CW)
1.0 0.8 0.6 LINS (dB)
Pout (dBm)
3fo
-50
20
-60 2fo
15 15 20 25 Pin (dBm) 30 -100 -50 0 TA (C) +50 +100
-70
6
2fo, 3fo Harmonics (dBC)
LINS
PG133G
TEST BOARD
IN 0.9 mm width.
NEC G130/131
R
R
OUT1
VCONT1
VCONT2
OUT2
TEST CIRCUIT
50 VCONT2 = 0 V/-3 V 1 000 pF OUT2 2 ZO = 50 3 4 7 6 5 1 8
50
ZO = 50
ZO = 50

0.4 mm thickness teflon glass R = 50
Using the same board that of PG130/131G
1 000 pF VCONT1 = -3 V/0 V OUT1
IN
7
PG133G
PG133G TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
VCONT1 0V -3 V
OUT1 0V IN OUT2 IN
OUT1 OUT2
VCONT2
-3 V
OUT1 IN OUT2
IN
OUT1 OUT2
8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm)
8 5
Detail of lead end
1 3.0 MAX.
4 4.94 0.2 3.2 0.1 0.87 0.2
1.8 MAX.
1.5 0.1
0.15 +0.10 -0.05
0.1 0.1
0.575 MAX.
0.65 0.3 +0.10 -0.05 0.10 M
0.5 0.2 0.15
8
3+7 -3
PG133G
Floating the PG133G It is possible to use the PG133G with only a single +3 V supply by employing a technique known as "floating". When the IC is floated using a +3 V supply, the voltage levels used to control the switch are elevated above ground by +3 V. When the PG133G is floated it is necessary to use DC blocking (C2, C3, C5) and grounding (C1, C4) capacitors. This enables the IC to isolated so that +3 V can be applied to RF line. The value for DC blocking capacitors should be chosen to accommodate the frequency of operation. Grounding capacitors are required to float the IC above ground. The value for grounding capacitor should be chosen to accommodate the frequency of operation. It is not recommended to float the PG133G for wide band application. (Floating the PG133G with +3 V/0 V supply at 2 GHz-band, BW 50 MHz)
GND
C1
C2 OUT2 1
4
VCONT2
C3 IN
5
8
VCONT1
C4 C5 GND
OUT1
PIN CONNECTIONS 1. VCONT2 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. VCONT1
C1, C4 = 10 pF below : C2, C3, C5 = 100 pF :
Grounding capacitor DC blocking capacitor
The distance between grounding capacitor and IC's GND pins, grounding capacitor and ground of the substrate should be as shorter as possible to avoid the parasitic parameters. IC's GND pin, No. 3, No. 4 and No. 6 are connected inside of the IC.
9
PG133G
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. [PG133G]
Recommended condition symbol IR30-00-2
Soldering process Infrared ray reflow
Soldering conditions Package peak temperature: 230 C Hour: within 30 s. (more than 210 C) Time: 2 time, Limited days: no.Note Package peak temperature: 215 C Hour: within 40 s. (more than 200 C), Time: 2 time, Limited days: no.Note Soldering tub temperature: less than 260 C, Hour: within 10 s. Time: 1 time, Limited days: no.Note Pin area temperature: less than 300 C, Hour: within 10 s. Limited days: no.Note
VPS
VP15-00-2
Wave Soldering
WS60-00-1
Pin part heating
Note It is storage days after opening a dry pack, the storage conditions are 25 C, less than 65 %, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method).
10
PG133G
[MEMO]
11
PG133G
Caution
The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the Japanese law concerned. Keep the law concerned and so on, especially in case of removal.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product.
M4 94.11
2

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